Semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

Reexamination Certificate

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Details

C257S098000, C257S099000, C438S022000, C361S714000, C361S715000, C361S717000

Reexamination Certificate

active

10934453

ABSTRACT:
A semiconductor package comprising a base material, an FPC substrate bonded through the intervention of an adhesive or an adhesive sheet on the base material and a semiconductor chip mounted on the FPC substrate, the semiconductor chip being mounted on the FPC substrate by FC bonding, the base material being formed by a resin, the base material having a concave portion or hole, and the semiconductor chip being mounted on the FPC substrate inside the concave portion or hole of the base material.

REFERENCES:
patent: 6605366 (2003-08-01), Yamaguchi et al.
patent: 6835960 (2004-12-01), Lin et al.
patent: 6858880 (2005-02-01), Horiuchi et al.
patent: 2001/0013423 (2001-08-01), Dalal et al.
patent: 2006/0018120 (2006-01-01), Linehan et al.
patent: 08-064717 (1996-03-01), None
patent: 11-126796 (1999-05-01), None
patent: 2001-203237 (2001-07-01), None
patent: 3316095 (2002-06-01), None
patent: 2003-163378 (2003-06-01), None
Definition of Thermal Plastic Defined by www.wikipedia.com search word Thermoplastic.

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