Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...
Reexamination Certificate
2007-04-03
2007-04-03
Lee, Hsien-Ming (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
In combination with or also constituting light responsive...
C257S098000, C257S099000, C438S022000, C361S714000, C361S715000, C361S717000
Reexamination Certificate
active
10934453
ABSTRACT:
A semiconductor package comprising a base material, an FPC substrate bonded through the intervention of an adhesive or an adhesive sheet on the base material and a semiconductor chip mounted on the FPC substrate, the semiconductor chip being mounted on the FPC substrate by FC bonding, the base material being formed by a resin, the base material having a concave portion or hole, and the semiconductor chip being mounted on the FPC substrate inside the concave portion or hole of the base material.
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Definition of Thermal Plastic Defined by www.wikipedia.com search word Thermoplastic.
Browdy and Neimark PLLC
Citizen Electronics Co. Ltd.
Kim Su C.
Lee Hsien-Ming
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