Semiconductor package

Details Semiconductor package Semiconductor package

2008-05-27

2008-05-27

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S675000, C257S686000, C257S712000

Reexamination Certificate

active

07378732

ABSTRACT:
A plurality of semiconductor packages is collectively fabricated on a wafer in a batch process and the wafer is then diced to obtain discrete semiconductor packages. The semiconductor package is a stacked body formed by bonding two or more semiconductor devices. Each semiconductor device comprises a substrate and a device pattern formed on a surface of the substrate. The semiconductor devices are stacked in such a fashion that a device pattern surface of the lower semiconductor device faces a non-device pattern surface of the semiconductor device stacked on the same.

REFERENCES:
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patent: 5627106 (1997-05-01), Hsu
patent: 6313517 (2001-11-01), Lauterbach et al.
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Patent Office of the People's Republic of China, First Office Action of Sep. 7, 2007.

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