Semiconductor package

Details Semiconductor package Semiconductor package

1999-04-05

2000-09-05

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257693, 257696, H01L 2348, H01L 2352

Patent

active

061147591

ABSTRACT:
A semiconductor package which can prevent peeling of outer leads from solder caused by thermal expansion and contraction, after the semiconductor package is mounted on a printed wiring board, is disclosed. The semiconductor package according to this invention includes a resin sealed body having a semiconductor chip sealed therein and outer leads led out of the resin sealed body. The outer lead has a first and second inflection parts, and the outer lead includes a first portion which defines the segment from a lead-out part of the outer lead in the resin sealed body to the first inflection part, a second portion which defines the segment from the first inflection part to the second inflection part, and a third portion which defines the segment from the second inflection part to a terminating part of the outer lead. The length of the first portion is larger than the length of the third portion.

REFERENCES:
Japanese Office Action dated Dec. 2, 1999, with partial translation.

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