Semiconductor package

Details Semiconductor package Semiconductor package

1997-12-08

1999-11-30

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257702, 257774, 257686, H01L 2302

Patent

active

059947721

ABSTRACT:
A semiconductor package includes at least one structure having a central hole formed at a center portion of the structure, a plurality of outer holes around the center hole, and a plurality of conductor pieces buried in the outer holes; at least one TAB having lead lines extending from sides of the TAB, the TAB having a configuration substantially corresponding to the central hole of the structure and formed over the central hole of the structure; and a molding material covering at least a portion of the TAB.

REFERENCES:
patent: 5763939 (1998-06-01), Yamashita

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