Semiconductor package

Details Semiconductor package Semiconductor package

1997-12-10

2000-04-11

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257737, 257738, 257782, 257778, 257787, H01L 2348, H01L 2352, H01L 2940

Patent

active

060491248

ABSTRACT:
A semiconductor package which includes a package substrate and a semiconductor chip located on the package substrate have coefficients of thermal expansion which differs by a large margin. The semiconductor chip has beveled edges and an epoxy is provided which reduce stresses on the semiconductor chip when the package is being heated.

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patent: 5554887 (1996-09-01), Sawai et al.
patent: 5641996 (1997-06-01), Omoya et al.
patent: 5706176 (1998-01-01), Quinn et al.
patent: 5751055 (1998-05-01), Maruyama et al.
patent: 5844320 (1998-12-01), Ono et al.
patent: 5898224 (1999-04-01), Akram

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