Semiconductor package

Details Semiconductor package Semiconductor package

1991-05-29

1992-11-24

Picard, Leo P.

Electricity: electrical systems and devices

Miscellaneous

174253, 174254, 174260, 174261, 361392, 361398, 361404, 361405, 257522, H05K 710

Patent

active

051668661

ABSTRACT:
The present invention relates to a semiconductor package which is suitable for attachment and wire-bonding of a large chip so that the high-performance and high-density tendency of semiconductor devices can be accomplished. According to the present invention, by connecting the electrodes of a chip to leads with electrical connection leads, even a large chip can be loaded without a pad. Also, since the bonding parts and lead-connection parts of the connection leads can be formed arbitrarily at any portion close to the electrodes of the chip, the chip is manufactured simply and the efficiency of the wire-bonding is improved due to the short wire-bonding length so that the reliability of products is efficiently improved.

REFERENCES:
patent: 3113248 (1963-12-01), Friedman
patent: 3967162 (1976-06-01), Ceresa et al.
patent: 4774635 (1988-09-01), Greenberg et al.
patent: 4833568 (1989-05-01), Berhold
patent: 4980082 (1990-12-01), Champagne et al.
patent: 5046954 (1991-09-01), Schmedding
Electronics (Technical Article) "Film-Carrier Technique Automates the Packaging of IC Chips" by Stephen Grossman, May 16, 1974.

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