Semiconductor package

Details Semiconductor package Semiconductor package

2007-11-08

2010-06-15

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

C257S678000, C438S048000

Reexamination Certificate

active

07737538

ABSTRACT:
A semiconductor package. The semiconductor package of the invention comprises: a substrate comprising at least one exposed area with photosensitive devices; a cover for isolating the exposed area from the external atmosphere, wherein one of either the substrate or the cover is a base, and the other is a top structure; and a dam formed on the base to form a cavity, wherein the top of the dam has a recess, the dam is attached the top structure by an adhesive, and the cavity corresponds to the exposed area.

REFERENCES:
patent: 6400004 (2002-06-01), Fan et al.
patent: 6489668 (2002-12-01), Oda et al.
patent: 6528869 (2003-03-01), Glenn et al.
patent: 6909168 (2005-06-01), Minamio et al.
patent: 7005720 (2006-02-01), Huang et al.
patent: 2004/0238923 (2004-12-01), Lee et al.
patent: 2598149 (2004-01-01), None
patent: 1921078 (2007-02-01), None

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