Semiconductor optical sensing device package

Details Semiconductor optical sensing device package Semiconductor optical sensing device package

1998-09-15

2000-09-19

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

257687, 257729, 257791, H01L 2306

Patent

active

061216755

ABSTRACT:
A semiconductor optical sensing device includes an insulating casing containing a semiconductor optical sensor chip fixed in the bottom thereof. Transparent silicone gel fills the interior of the casing and covers the sensor chip. A transparent plate covers both the sensor chip and the silicone gel. Holes in the casing allow expansion and contraction of the silicone gel without disturbing the optical properties of the sensor chip, and without permitting the formation of bubbles in the silicone gel.

REFERENCES:
patent: 4710797 (1987-12-01), Tanaka
patent: 4723156 (1988-02-01), Okuaki
patent: 4766095 (1988-08-01), Hiroshi
patent: 4801998 (1989-01-01), Okuaki
patent: 4961106 (1990-10-01), Butt et al.
patent: 5068713 (1991-11-01), Toda
patent: 5399805 (1995-03-01), Tyler et al.
patent: 5962810 (1999-10-01), Glenn

Affiliated with

Also associated with

Rating

Semiconductor optical sensing device package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor optical sensing device package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor optical sensing device package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1076123