Semiconductor non-laminate package and method

Details Semiconductor non-laminate package and method Semiconductor non-laminate package and method

1998-04-17

1999-07-27

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257693, 257793, 257795, 257789, H01L 2348, H01L 2352, H01L 2940

Patent

active

059295228

ABSTRACT:
A semiconductor device package includes a carrier substrate molded of a non-laminate material. A plurality of conductive metal balls are molded within the non-laminate carrier substrate to provide an electrical connection between opposite sides of the substrate. The conductive metal balls provide conductive columns through the substrate for electrically connecting a chip mounted on one side of the substrate to solder balls on an opposite side of the substrate for mounting the package on a printed circuit board. The conductive columns eliminate the need for via holes which are used in known packages. The package with conductive columns provides a more compact, more precise, and lower cost package which is less susceptible to moisture damage than the known packages employing via holes.

REFERENCES:
patent: 4807021 (1989-02-01), Okumura
patent: 5166773 (1992-11-01), Temple et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5293072 (1994-03-01), Tsuji et al.
patent: 5583376 (1996-12-01), Sickler et al.
patent: 5777382 (1998-07-01), Abbott et al.

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