Semiconductor mushroom structure fabrication

Details Semiconductor mushroom structure fabrication Semiconductor mushroom structure fabrication

1986-12-11

1988-06-07

Bashore, S. Leon

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

437 89, 437 90, 437249, 156612, 156657, H01L 2120, C30B 2960

Patent

active

047494417

ABSTRACT:
A method of fabricating single crystal silicon in a "mushroom" shape for use in fabricating devices such as a Silicon-On-Insulator-Like MOSFET. One embodiment of the inventive method entails fabricating a hole-within-a-hole structure in a thick silicon dioxide layer disposed on a single crystal silicon substrate, growing single crystal silicon in the inner hole, etching back the silicon dioxide layer to expose a portion of the silicon in the inner hole, and growing single crystal silicon by selective epitaxial growth in the outer hole.

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