Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2005-09-27
2005-09-27
Whitehead, Jr., Carl (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S666000, C257S667000, C257S688000, C257S707000, C257S777000, C257S778000
Reexamination Certificate
active
06949822
ABSTRACT:
A multichip module has a substrate, which receives several flip chip and for other semiconductor die on one surface and has vias extending through the substrate from the flip chip bottom electrodes to solder ball electrodes on the bottom of the substrate. Passive components are also mounted on the top of the substrate and are connected to further vias which extend to respective ball contacts at the substrate bottom. In one embodiment, the bottom surfaces and electrodes of the die are insulated and their tops (and drain electrodes) are connected by a moldable conductive layer. In another embodiment the top surface of the substrate is covered by an insulation cap, which may be finned for improved thermal properties. The passives are upended to have their longest dimension perpendicular to the substrate surface and are between the fin valleys. The insulation cover is a cap which fits over the top of the substrate, with mold lock depressions contained in the junction between the cap peripheral interior edge and the substrate mating edge surfaces.
REFERENCES:
patent: 5061686 (1991-10-01), Ruby
patent: 5302852 (1994-04-01), Kaneda et al.
patent: 5311402 (1994-05-01), Kobayashi et al.
patent: 5336456 (1994-08-01), Eskildsen et al.
patent: 5795799 (1998-08-01), Hosoya
patent: 5866952 (1999-02-01), Wojnarowski
patent: 5907477 (1999-05-01), Tuttle et al.
patent: 5956576 (1999-09-01), Toy et al.
patent: 6054759 (2000-04-01), Nakamura
patent: 6071755 (2000-06-01), Baba et al.
patent: 6127724 (2000-10-01), DiStefano
patent: 6157080 (2000-12-01), Tamaki et al.
patent: 6201301 (2001-03-01), Hoang
patent: 6268654 (2001-07-01), Glenn et al.
patent: 6354485 (2002-03-01), Distefano
patent: 6369448 (2002-04-01), McCormick
patent: 6392294 (2002-05-01), Yamaguchi
patent: 6586677 (2003-07-01), Glenn
patent: 6602740 (2003-08-01), Mitchell
patent: 6724214 (2004-04-01), Manna et al.
patent: 6774466 (2004-08-01), Kajiwara et al.
patent: 6777794 (2004-08-01), Nakajima
patent: 2001/0015492 (2001-08-01), Akram et al.
patent: 0578411 (1994-12-01), None
patent: 356012756 (1981-02-01), None
patent: 35821813 (1983-12-01), None
patent: 404092457 (1992-03-01), None
patent: 05267558 (1993-10-01), None
patent: 406112401 (1994-04-01), None
patent: 410335544 (1998-12-01), None
patent: 2001210778 (2001-08-01), None
Cheah Chuan
Shivkumar Bharat
International Rectifier Corporation
Jr. Carl Whitehead
Mitchell James
Ostrolenk Faber Gerb & Soffen, LLP
LandOfFree
Semiconductor multichip module package with improved thermal... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor multichip module package with improved thermal..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor multichip module package with improved thermal... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3401601