Semiconductor multi-package stack

Details Semiconductor multi-package stack Semiconductor multi-package stack

1995-10-27

1997-10-14

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257723, 257725, 257777, 257733, H01L 2348, H01L 2354

Patent

active

056775695

ABSTRACT:
A stacked semiconductor multi-package including a plurality of individual semiconductor chip packages stacked over one another. The individual packages have a substrate provided with a plurality of bonding pads, electrode pads electrically connected to the bonding pads through wires, and chips attached to upper and lower surfaces of the substrate. A paddles lead frame is provided onto which the individual packages are attached to upper and lower surfaces thereof, and variants thereof. For these packages, since individual packages are mounted on upper and lower surfaces of a single printed circuit board or lead frame, the mounting density can be significantly increased and their production can be simplified.

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patent: 5332922 (1994-07-01), Oguchi et al.
patent: 5408123 (1995-04-01), Murai
patent: 5473188 (1995-12-01), Ando
patent: 5539250 (1996-07-01), Kitano et al.
patent: 5563773 (1996-10-01), Katsumuta

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