Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent
1996-11-18
1998-08-04
Lim, Krisna
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
257635, 257638, 257678, 257211, 361719, 361792, 361 52, H01L 2328
Patent
active
057898057
ABSTRACT:
An electronic circuit package having a wiring substrate, at least two semiconductor chips and a bus line. All the semiconductor chips to be connected by means of the bus line are bare chip packaged on a wiring substrate, and the semiconductor chips and the wiring substrate are connected by wiring bonding between wire bonding pads formed on the semiconductor chips and the wiring substrate. The wiring substrate may be a multilayer.
Preferably, there is an insulating layer partially formed on the surface of the multilayer wiring substrate and a die bonding ground formed on the is surface of the insulating layer, in order to use a portion of the multilayer wing substrate under the die bonding ground as a wiring or a via hole region, and at least one of the semiconductor chips is formed on the die bonding ground.
The bus line preferably includes two data bus lines, the semiconductor chips connected with one data bus line are formed on one side of the wiring substrate and the semiconductor chips connected with the other data bus line are formed on the other side of the wiring substrate.
REFERENCES:
patent: 5017993 (1991-05-01), Shibata
patent: 5019943 (1991-05-01), Fassbender et al.
patent: 5200810 (1993-04-01), Wojnarowski et al.
patent: 5237203 (1993-08-01), Massaron
patent: 5241456 (1993-08-01), Marcinkiewicz et al.
patent: 5325265 (1994-06-01), Turlik et al.
Akiyama Masatsugu
Ihara Hirokazu
Kanekawa Nobuyasu
Kawabata Kiyoshi
Okishima Tetsuya
Hitachi , Ltd.
Lim Krisna
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