Semiconductor multi-chip module

Details Semiconductor multi-chip module Semiconductor multi-chip module

1996-11-18

1998-08-04

Lim, Krisna

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257635, 257638, 257678, 257211, 361719, 361792, 361 52, H01L 2328

Patent

active

057898057

ABSTRACT:
An electronic circuit package having a wiring substrate, at least two semiconductor chips and a bus line. All the semiconductor chips to be connected by means of the bus line are bare chip packaged on a wiring substrate, and the semiconductor chips and the wiring substrate are connected by wiring bonding between wire bonding pads formed on the semiconductor chips and the wiring substrate. The wiring substrate may be a multilayer.
Preferably, there is an insulating layer partially formed on the surface of the multilayer wiring substrate and a die bonding ground formed on the is surface of the insulating layer, in order to use a portion of the multilayer wing substrate under the die bonding ground as a wiring or a via hole region, and at least one of the semiconductor chips is formed on the die bonding ground.
The bus line preferably includes two data bus lines, the semiconductor chips connected with one data bus line are formed on one side of the wiring substrate and the semiconductor chips connected with the other data bus line are formed on the other side of the wiring substrate.

REFERENCES:
patent: 5017993 (1991-05-01), Shibata
patent: 5019943 (1991-05-01), Fassbender et al.
patent: 5200810 (1993-04-01), Wojnarowski et al.
patent: 5237203 (1993-08-01), Massaron
patent: 5241456 (1993-08-01), Marcinkiewicz et al.
patent: 5325265 (1994-06-01), Turlik et al.

Affiliated with

Also associated with

Rating

Semiconductor multi-chip module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor multi-chip module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor multi-chip module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1180136