Semiconductor-mounted device and method for producing same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Reexamination Certificate

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Details

C257S773000, C257S776000, C257S778000, C257S788000, C257S789000, C257S793000, C257SE21502, C257SE21503, C257S177000, C257S178000

Reexamination Certificate

active

11020132

ABSTRACT:
Semiconductor-mounted device comprises wired board, first semiconductor chip mounted on first side of wired board, second semiconductor chip mounted on second side of wired board and sealing resin sealing, with a same height, a region disposed at and around first semiconductor chip and opposite, across wired board, to at least an area of projecting electrodes of second semiconductor chip; and a producing method thereof. Semiconductor-mounted device also comprises wired board, first semiconductor chip mounted on first side of wired board, second semiconductor chip mounted on second side of wired board and resin sheet covering, at substantially a same height as first semiconductor chip, a region disposed around first semiconductor chip and opposite, across wired board, to at least an area of projecting electrodes of second semiconductor chip, back surface of first semiconductor chip being exposed; and a producing method thereof.

REFERENCES:
patent: 5900312 (1999-05-01), Sylvester
patent: 6229215 (2001-05-01), Egawa
patent: 6239496 (2001-05-01), Asada
patent: 6798044 (2004-09-01), Joshi
patent: 2002/0030261 (2002-03-01), Rolda et al.
patent: 2004/0140538 (2004-07-01), Harvey
patent: 2004/0159955 (2004-08-01), Shen
patent: 2634351 (1993-04-01), None

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