Semiconductor module with vertically mounted semiconductor...

Details Semiconductor module with vertically mounted semiconductor... Semiconductor module with vertically mounted semiconductor...

2006-05-23

2006-05-23

Chèrvinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S719000, C257S706000, C165S080300, C165S185000

Reexamination Certificate

active

07050303

ABSTRACT:
A semiconductor module with vertically arranged semiconductor packages may include a module board with a plurality of insertion holes. A plurality of semiconductor packages may be inserted in a vertical direction into corresponding insertion holes. The module may include a heat sink composed of a base plate and a plurality of protrusions. The protrusion may extend downward from the base plate.

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patent: 6075287 (2000-06-01), Ingraham et al.
patent: 6480014 (2002-11-01), Li et al.
patent: 6862185 (2005-03-01), Morris
patent: 2005/0052849 (2005-03-01), Keating et al.
patent: 1999-026510 (1999-04-01), None
patent: 10-0356800 (2002-10-01), None

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