Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-03-20
2007-03-20
Whitehead, Jr., Carl (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257SE23102
Reexamination Certificate
active
10610816
ABSTRACT:
One method of achieving the above subjects is by connecting a block member14, which is connected to the side opposite to that of a semiconductor chip11having insulating substrates12and13connected to the top and bottom of the semiconductor chip11, to a block member15across an laminated structure constituted by the semiconductor chip11and the insulating substrates12and13.
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European Search Report Mailed Feb. 24, 2004.
Anan Hiromichi
Mashino Keiichi
Ochiai Yoshitaka
Yoshizaki Atsuhiro
Crowell & Moring LLP
Dolan Jennifer M
Hitachi , Ltd.
Hitachi Car Engineering Co. Ltd.
Jr. Carl Whitehead
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