Semiconductor module and method of manufacturing the same

Details Semiconductor module and method of manufacturing the same Semiconductor module and method of manufacturing the same

2007-11-19

2010-11-16

Wilson, Allan R (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

C257S692000, C257SE23004, C257SE23013

Reexamination Certificate

active

07834439

ABSTRACT:
A semiconductor module preferably includes a semiconductor package and a printed circuit board (PCB). The semiconductor package can include an outer terminal. The PCB can include a terminal land that is electrically connected to the outer terminal. The PCB preferably has a recess configured to at least partially expose the terminal land and to receive the outer terminal. The recess preferably has a width that is less than a width of the semiconductor package. Damage to edge portions of the semiconductor package whose outer terminal is received into the recess may be prevented, because the edge portions make contact with and are supported by the PCB. One or more support members can also be provided to contact one or more sides of the edge portions of the semiconductor package to further prevent damage due to horizontal impacts.

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patent: 2005-197354 (2005-07-01), None
patent: 2006-0026130 (2006-03-01), None
Davidson et al.—Fermi National Accelerator Laboratory, Measurement of the Elastic Modulus of Kapton Perpendicular to the Plane of the Film at Room and Cryogenic Temperatures, Apr. 1992, Fourth Annual IISSC Conference (Mar. 4-6, 1992), FERMILAB-Conf-92/100.
No author listed, ULTEM® Detailed Properties (Polyetherimide), Copyright 1997-2005 (no months given), Parker-TexLoc, The TexLoc Closet, pp. 1 and 2, http://www.texloc.com/closet/cl—ultem—properties.htm.
English language abstract of Japanese Publication No. 2005-197342.
English language abstract of Japanese Publication No. 2005-197354.
English language abstract of Korean Publication No. 2006-0026130.

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