Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2005-02-08
2005-02-08
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257S703000, C257S705000, C257S707000
Reexamination Certificate
active
06853088
ABSTRACT:
A semiconductor module and a method for its fabrication are described. The semiconductor module has at least one semiconductor component that is disposed directly on a substrate body. The substrate body has an insulating ceramic provided with a metal layer. At least one connection conductor is joined to the metal layer by welding, in particular laser microwelding.
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Ferber Gottfried
Pelmer Reimund
EUPEC GmbH
Greenberg Laurence A.
Mayback Gregory L.
Nelms David
Stemer Werner H.
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