Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2009-03-20
2010-10-05
Zarneke, David A (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C257SE23123
Reexamination Certificate
active
07807504
ABSTRACT:
A semiconductor module is disclosed. One embodiment provides a first semiconductor chip having a first contact pad on a first main surface and a second contact pad on a second main surface, a first electrically conductive layer applied to the first main surface, a second electrically conductive layer applied to the second main surface, and an electrically insulating material covering the first electrically conductive layer, wherein a surface of the second electrically conductive layer forms an external contact pad and the second electrically conductive layer has a thickness of less than 200 μm.
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Office Action for German Patent Application No. 10 2008 034 164.9-33 dated May 17, 2010 (5 pages).
Hoeglauer Josef
Otremba Ralf
Schiess Klaus
Dicke Billig & Czaja, PLLC
Infineon - Technologies AG
Wagner Jenny L
Zarneke David A
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