Semiconductor metallization method

Details Semiconductor metallization method Semiconductor metallization method

1991-02-21

1992-09-15

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437188, 437197, 437942, 148DIG20, 148DIG93, H01L 2126

Patent

active

051478196

ABSTRACT:
A method of applying an alloy layer of predetermined thickness on a semiconductor wafer to fill contact openings having a defined diameter, the method comprising the following steps:

REFERENCES:
patent: 3413157 (1968-11-01), Kuiper
patent: 4042954 (1977-08-01), Harris
patent: 4660062 (1987-04-01), Nishizawa
patent: 4923526 (1990-05-01), Harada
H. Ono, et al "Development of a Planarized Al-Si Contact Filling Technology" Proc. 1990 VMIC, Jun. 1990 pp. 76-82.

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