Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-08-02
2011-08-02
Dinh, Tuan T (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S782000, C361S784000
Reexamination Certificate
active
07990734
ABSTRACT:
A semiconductor memory module having a reverse mounted chip resistor, and a method of fabricating the same are provided. By reverse mounting the chip resistor on the semiconductor memory module, the resistive material is protected, thereby preventing open circuits caused by damage to the resistive material. Also, a chip-resistor connection pad of a module substrate is formed to extend higher from the module substrate than other connection pads connected to other elements. Thus, the resistive material of the chip resistor does not contact the module substrate, thereby preventing poor alignment and defective connections.
REFERENCES:
patent: 7180007 (2007-02-01), Nishikawa et al.
patent: 7468294 (2008-12-01), Yamaura et al.
patent: 05-152101 (1993-06-01), None
patent: 2002-231502 (2002-08-01), None
patent: 2003-282303 (2003-10-01), None
English language abstract of Japanese Publication No. 05-152101.
English language abstract of Japanese Publication No. 2002-231502.
English language abstract of Japanese Publication No. 2003-282303.
An Su-Yong
Bang Hyo-Jae
Choi Hyun-Seok
Hwang Hyung-Mo
Kim Yong-Hyun
Dinh Tuan T
Muir Patent Consulting, PLLC
Samsung Electronics Co,. Ltd.
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