Semiconductor memory module having double-sided stacked memory c

Details Semiconductor memory module having double-sided stacked memory c Semiconductor memory module having double-sided stacked memory c

1997-12-03

1999-06-08

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

257686, 257685, 257723, H01L 2348, H01L 2352, H01L 2940

Patent

active

059106859

ABSTRACT:
In the present invention, memory chips are stuck together in stacked fashion by TAB (tape automated bonding), and a multiple memory chip and lead complex like an SOP (small out-line package) is formed of the chips and leads, whereby a memory module of high packaging density can be realized by a flat packaging technique.

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patent: 5334875 (1994-08-01), Sugano et al.
patent: 5422514 (1995-06-01), Griswold et al.
patent: 5502333 (1996-03-01), Bertin et al.
patent: 5708298 (1998-01-01), Masayuki et al.

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