Semiconductor memory module having double-sided stacked memory c

Details Semiconductor memory module having double-sided stacked memory c Semiconductor memory module having double-sided stacked memory c

1996-12-10

1998-01-13

Meier, Stephen

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257685, 257686, 257777, H01L 2334, H01L 2302

Patent

active

057082987

ABSTRACT:
In the present invention, memory chips are stuck together in stacked fashion by TAB (tape automated bonding), and a multiple memory chip and lead complex like an SOP (small out-line package) is formed of the chips and leads, whereby a memory module of high packaging density can be realized by a flat packaging technique.

REFERENCES:
patent: 3370203 (1968-02-01), Kravitz et al.
patent: 3577037 (1971-05-01), Di Pietro et al.
patent: 4398235 (1983-08-01), Lutz et al.
patent: 5138438 (1992-08-01), Masayuki et al.
patent: 5239448 (1993-08-01), Perkins et al.
patent: 5334875 (1994-08-01), Sugano et al.
patent: 5422514 (1995-06-01), Griswold et al.
patent: 5502333 (1996-03-01), Bertin et al.

Affiliated with

Also associated with

Rating

Semiconductor memory module having double-sided stacked memory c does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor memory module having double-sided stacked memory c, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor memory module having double-sided stacked memory c will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-329121