Semiconductor memory module having an oblique memory chip

Details Semiconductor memory module having an oblique memory chip Semiconductor memory module having an oblique memory chip

2007-04-26

2010-10-12

Chu, Chris (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257SE25012, C257S686000, C257S776000, C438S125000

Reexamination Certificate

active

07812445

ABSTRACT:
Provided is a semiconductor memory module allowing a filling member formed between a module substrate and memory chips mounted on the module substrate to completely fill the space between the module substrate and the memory chips. According to embodiments of the present invention, the semiconductor memory module includes a module substrate having at least one memory chip mounted on the substrate such that its edges are oblique to major and minor axes bisecting the module substrate. The oblique orientation allows for an improved opening between memory chips formed on the substrate so that the filling member may be properly formed between the module substrate and the memory chips to prevent voids where the filling member is not formed.

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English language abstract of Japanese Publication No. 2000-252418.

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