Semiconductor memory module

Details Semiconductor memory module Semiconductor memory module

1994-05-16

1996-04-02

Nguyen, Viet Q.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

361764, 361767, 361768, 361777, 361783, 257690, 257784, 257786, 365 63, H01L 2160, H05G 118

Patent

active

055043739

ABSTRACT:
A semiconductor memory module is formed of semiconductor packages respectively having at least one defect data line combined to be mounted to a module substrate which has two rows of auxiliary pads for excluding the defect data line of the mounted semiconductor packages from overall data lines of the module to thus attain more than a required memory capacity. By connecting the auxiliary pads with coupling units of resistors or jumper cables to isolate the defect data lines, the semiconductor memory module achieves the required memory capacity and utilizes defective semiconductor packages to reduce manufacturing costs, to attain excellent compatibility resulting from employing all kinds of semiconductor packages, and to simplify the data line connection process. Further, reworking semiconductor package is easy which improves yield, and humid air is prevented from permeating into the interior of the molding resin thereby preventing failures such as disconnection of wires and improving reliability.

REFERENCES:
patent: 3753235 (1973-07-01), Daughton et al.
patent: 3777221 (1973-12-01), Tatusko et al.
patent: 4458297 (1984-07-01), Stopper et al.
patent: 4656605 (1987-04-01), Clayton
patent: 4795895 (1989-01-01), Hara et al.
patent: 4847732 (1989-07-01), Stopper et al.

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