Static information storage and retrieval – Interconnection arrangements
Reexamination Certificate
2007-08-21
2007-08-21
Ho, Hoai V. (Department: 2827)
Static information storage and retrieval
Interconnection arrangements
C365S149000, C365S230030, C365S230060
Reexamination Certificate
active
11221684
ABSTRACT:
A semiconductor memory device may include a memory cell array, a bit line sense amplifier, a sub word line driver, and an electrode. The memory cell array may include a sub memory cell array connected between sub word lines and bit line pairs and having memory cells which are selected in response to a signal transmitted to the sub word lines and column selecting signal lines. The bit line sense amplifier may be configures to sense and amplify data of the bit line pairs. The sub word line driver may be configured to combine signals transmitted from word selecting signal lines and signals transmitted from main word lines to select the sub word lines. Moreover, the memory cell array may be configured to transmit data between the bit line pairs and local data line pairs and to transmit data between the local data line pairs and global data line pairs. The electrode may be configured to cover the whole memory cell array and to apply a voltage needed for the memory cells. The local data line pairs may be arranged on a first layer above the electrode in the same direction as the sub word line. The column selecting signal lines and the global data line pairs may be arranged on a second layer above the electrode in the same direction as the bit line. The word selecting signal lines and the main word lines may be arranged on a third layer above the electrode in the same direction as the sub word line. Related methods of signal line arrangement are also discussed.
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Choi Jong-Hyun
Lee Jong-Eon
Lee Jung-Bae
Min Young-Sun
Park Chul-Woo
Ho Hoai V.
Myers Bigel & Sibley & Sajovec
Samsung Electronics Co,. Ltd.
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