Semiconductor memory device having stack-type memory cells and a

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257356, 257528, 257529, 257530, 438239, H01L 2362, H01L 2900, H01L 218242

Patent

active

061440744

ABSTRACT:
At least one dummy storage node is formed for a plurality of storage nodes provided in stack type memory cells in which a plate electrode is grounded through the at least one dummy storage node, thereby charges flowed into the plate electrode being discharged, when dry etching is performed by using charged particles, thus preventing electrical stress from acting on a capacitor dielectric film provided between the storage nodes and the plate electrode.

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Park, et al. "A Stack Capacitor Technology with (Ba,Sr)TiO.sub.3 Dielectrics and Pt Electrodes for 1Giga-Bit Density DRAM," 1996 Symposium on VLSI Technology Digest of Technical Papers, 3.2, pp. 24-25.

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