Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate
2006-03-07
2008-11-18
Dang, Phuc T (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Having insulated electrode
C257S295000, C257S311000, C438S257000, C438S260000
Reexamination Certificate
active
07453116
ABSTRACT:
A silicon nitride film for storing electric charge is formed on a semiconductor substrate while placing a tunnel oxide film in between, and the silicon nitride film is then subjected to hydrogen plasma treatment so as to effectively erase unnecessary charge stored therein during various process steps in fabrication of the semiconductor memory device, to thereby stabilize the threshold voltage (Vth) of the semiconductor memory device.
REFERENCES:
patent: 4264376 (1981-04-01), Yatsuda et al.
patent: 6103572 (2000-08-01), Kirihara
patent: 6713388 (2004-03-01), Tseng et al.
patent: 6794694 (2004-09-01), Diodato et al.
patent: 55-30846 (1980-03-01), None
patent: 61-154174 (1986-07-01), None
patent: 61-288471 (1986-12-01), None
patent: 61-290771 (1986-12-01), None
patent: 10-284627 (1998-10-01), None
patent: 11-163072 (1999-06-01), None
patent: 2000-174126 (2000-06-01), None
patent: WO 94/10686 (1994-05-01), None
Office Action dated Jun. 17, 2008 issued in corresponding Japanese Application No. 2002-355933.
Enda Takayuki
Takagi Hideo
Takamatsu Tsukasa
Umetsu Miyuki
Dang Phuc T
Spansion LLC
Westerman, Hattori, Daniels & Adrian , LLP.
LandOfFree
Semiconductor memory device and method of fabricating the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor memory device and method of fabricating the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor memory device and method of fabricating the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4025527