Semiconductor memory component comprising stacked memory modules

Details Semiconductor memory component comprising stacked memory modules Semiconductor memory component comprising stacked memory modules

1994-02-02

1995-12-05

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

257690, 257692, 257773, 257777, 257776, 257784, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

054731968

ABSTRACT:
A memory component has a rectangular semiconductor substrate containing active memory circuits and output terminals on a major surface thereof. An insulating layer on the major surface receives a plurality of metal connection leads, connecting the output terminals to connection pads located on the major surface along only one of longer sides of the substrate. A plurality of additional pads are distributed between the connecting pads and are devoid of connection leads. A memory module comprising several stacked memory components is also described, which uses the additional pads as relays.

REFERENCES:
patent: 5239447 (1993-08-01), Cotues et al.

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