Semiconductor member, and process for preparing same and semicon

Details Semiconductor member, and process for preparing same and semicon Semiconductor member, and process for preparing same and semicon

1996-11-25

1998-05-12

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566311, 1566571, 216 2, 216 36, 216 56, 257347, H01L 2100

Patent

active

057500002

ABSTRACT:
A semiconductor device having a substrate with an insulating surface and a non-porous semiconductor region bonded to the body of the device. A porous semiconductor region on the surface of the substrate was removed by etching.

REFERENCES:
patent: 3414434 (1968-12-01), Manasevit
patent: 3997381 (1976-12-01), Wanlass
patent: 4409724 (1983-10-01), Tasch, Jr. et al.
patent: 4800527 (1989-01-01), Ozaki et al.
patent: 4809056 (1989-02-01), Shirato
patent: 4868140 (1989-09-01), Yonehara
patent: 5010033 (1991-04-01), Tokunaga
patent: 5073230 (1991-12-01), Maracas et al.
Silicon-On Insulator Technology and Devices, W. P. Maszara, vol. 90-6, 1990, pp. 199-212B, "SOI by Wafer Bonding: A Review".
Journal of Applied Physics, vol. 64, No. 10, Nov. 15, 1988, pp. 4943-4950, W.P. Maszara et al., "Bonding of Silicon Wafers For Silicon-On-Insulator".
Applied Physics Letters, vol. 43, No. 3, Aug. 1, 1983, pp. 263-265, M. Kimura et al., "Epitaxial Film Transfer Technique For Producing single crystal Si Film on an Insulating Substrate".
1989 IEEE SOS/SOI Technology Conference, 1989, pp. 64-65, A. Soderbarg, "Fabrication of Besoi-Materials Using Implanted Nitrogen As An Effective Etch Stop Barrier".

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