Semiconductor manufacturing process

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S706000, C438S710000, C438S714000, C438S720000, C438S723000, C438S735000, C438S906000, C438S963000, C134S001200, C216S046000, C216S067000

Reexamination Certificate

active

07977244

ABSTRACT:
Disclosed is a semiconductor manufacturing process, in which a fluorine radical-containing plasma is used to etch a hard mask and a layer therebeneath; and a treatment is carried out using a gas reactive to fluorine radicals for reacting with residual fluorine radicals to form a fluorine-containing compound and remove it. Thus, precipitates formed by the reaction of fluorine radicals and titanium components existing in the hard mask to cause a process defect can be avoided.

REFERENCES:
patent: 5538921 (1996-07-01), Obeng
patent: 6025273 (2000-02-01), Chen et al.
patent: 6033990 (2000-03-01), Kishimoto et al.
patent: 6107192 (2000-08-01), Subrahmanyan et al.
patent: 6121150 (2000-09-01), Avanzino et al.
patent: 6153530 (2000-11-01), Ye
patent: 6380096 (2002-04-01), Hung
patent: 6693030 (2004-02-01), Subrahmanyan et al.
patent: 7094705 (2006-08-01), Lin et al.
patent: 7557043 (2009-07-01), Lin et al.
patent: 2003/0008490 (2003-01-01), Xing et al.
patent: 2003/0044725 (2003-03-01), Hsue et al.
patent: 2004/0026040 (2004-02-01), Kurihara
patent: 2004/0082164 (2004-04-01), Chen et al.
patent: 2004/0178169 (2004-09-01), Desphande
patent: 2004/0219797 (2004-11-01), Honda
patent: 2004/0248404 (2004-12-01), Subrahmanyan et al.
patent: 2005/0039854 (2005-02-01), Matsuyama
patent: 2006/0154486 (2006-07-01), Balasubramaniam
patent: 2006/0199370 (2006-09-01), Dai et al.
patent: 2006/0286793 (2006-12-01), Lin et al.
patent: 2007/0051471 (2007-03-01), Kawaguchi et al.
patent: 2007/0184996 (2007-08-01), Weng et al.
patent: 2007/0249165 (2007-10-01), Huang et al.
patent: 2008/0050923 (2008-02-01), Kim et al.
patent: 2008/0121619 (2008-05-01), Lin et al.
patent: 2008/0124917 (2008-05-01), Oh et al.
patent: 2008/0171433 (2008-07-01), Huang et al.
patent: 2009/0142931 (2009-06-01), Wang et al.
patent: 2009/0197404 (2009-08-01), Yang
patent: 2009/0246951 (2009-10-01), Feustel et al.
patent: 1468977 (2004-01-01), None
patent: 1738021 (2006-02-01), None
patent: 589926 (2004-06-01), None
patent: I233644 (2005-06-01), None
patent: 200636857 (2006-10-01), None
patent: I263276 (2006-10-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor manufacturing process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor manufacturing process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor manufacturing process will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2706079

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.