Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2011-07-12
2011-07-12
Alanko, Anita K (Department: 1713)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C438S706000, C438S710000, C438S714000, C438S720000, C438S723000, C438S735000, C438S906000, C438S963000, C134S001200, C216S046000, C216S067000
Reexamination Certificate
active
07977244
ABSTRACT:
Disclosed is a semiconductor manufacturing process, in which a fluorine radical-containing plasma is used to etch a hard mask and a layer therebeneath; and a treatment is carried out using a gas reactive to fluorine radicals for reacting with residual fluorine radicals to form a fluorine-containing compound and remove it. Thus, precipitates formed by the reaction of fluorine radicals and titanium components existing in the hard mask to cause a process defect can be avoided.
REFERENCES:
patent: 5538921 (1996-07-01), Obeng
patent: 6025273 (2000-02-01), Chen et al.
patent: 6033990 (2000-03-01), Kishimoto et al.
patent: 6107192 (2000-08-01), Subrahmanyan et al.
patent: 6121150 (2000-09-01), Avanzino et al.
patent: 6153530 (2000-11-01), Ye
patent: 6380096 (2002-04-01), Hung
patent: 6693030 (2004-02-01), Subrahmanyan et al.
patent: 7094705 (2006-08-01), Lin et al.
patent: 7557043 (2009-07-01), Lin et al.
patent: 2003/0008490 (2003-01-01), Xing et al.
patent: 2003/0044725 (2003-03-01), Hsue et al.
patent: 2004/0026040 (2004-02-01), Kurihara
patent: 2004/0082164 (2004-04-01), Chen et al.
patent: 2004/0178169 (2004-09-01), Desphande
patent: 2004/0219797 (2004-11-01), Honda
patent: 2004/0248404 (2004-12-01), Subrahmanyan et al.
patent: 2005/0039854 (2005-02-01), Matsuyama
patent: 2006/0154486 (2006-07-01), Balasubramaniam
patent: 2006/0199370 (2006-09-01), Dai et al.
patent: 2006/0286793 (2006-12-01), Lin et al.
patent: 2007/0051471 (2007-03-01), Kawaguchi et al.
patent: 2007/0184996 (2007-08-01), Weng et al.
patent: 2007/0249165 (2007-10-01), Huang et al.
patent: 2008/0050923 (2008-02-01), Kim et al.
patent: 2008/0121619 (2008-05-01), Lin et al.
patent: 2008/0124917 (2008-05-01), Oh et al.
patent: 2008/0171433 (2008-07-01), Huang et al.
patent: 2009/0142931 (2009-06-01), Wang et al.
patent: 2009/0197404 (2009-08-01), Yang
patent: 2009/0246951 (2009-10-01), Feustel et al.
patent: 1468977 (2004-01-01), None
patent: 1738021 (2006-02-01), None
patent: 589926 (2004-06-01), None
patent: I233644 (2005-06-01), None
patent: 200636857 (2006-10-01), None
patent: I263276 (2006-10-01), None
Huang Chun-Jen
Lai Yu-Tsung
Liao Jiunn-Hsiung
Yau Jyh-Cherng
Alanko Anita K
Hsu Winston
Margo Scott
United Microelectronics Corp.
LandOfFree
Semiconductor manufacturing process does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor manufacturing process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor manufacturing process will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2706079