Material or article handling – Associated with semiconductor wafer handling – Includes means for gripping wafer
Reexamination Certificate
2005-03-01
2005-03-01
Ridley, Richard (Department: 3651)
Material or article handling
Associated with semiconductor wafer handling
Includes means for gripping wafer
Reexamination Certificate
active
06860711
ABSTRACT:
A semiconductor-manufacturing device is equipped with a load-lock chamber and a reactor, which are directly connected, wherein a semiconductor wafer is transferred by a transferring arm provided inside the load-lock chamber from the load-lock chamber onto a susceptor provided inside the reactor. The device includes a buffer mechanism for keeping a semiconductor wafer standing by inside the reactor. The buffer mechanism includes at least two supporting means, which are provided around the susceptor to support the semiconductor wafer and which rotate in a horizontal direction, a shaft means for supporting the supporting means in a vertical direction, a rotating mechanism for rotating the supporting means coupled to the shaft means, and an elevating means for moving the shaft means up and down.
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ASM Japan K.K.
Knobbe Martens Olson & Bear LLP
Ridley Richard
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