Semiconductor manufacturing apparatus, and positioning jig...

Details Semiconductor manufacturing apparatus, and positioning jig... Semiconductor manufacturing apparatus, and positioning jig...

2005-07-26

2005-07-26

Hassanzadel, P. (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With workpiece support

C118S500000, C118S728000, C156S345540, C269S296000, C269S302000, C279S128000, C361S234000

Reexamination Certificate

active

06921457

ABSTRACT:
The placement of a wafer can be performed with good positional precision, and the positioning of wafer clamps during maintenance is facilitated. A tapered recess is formed in that portion of the wafer support on which a wafer is placed. When a wafer is placed in the recess, the sloped surface inside this recess comes into contact with the edge of the wafer from beneath the wafer. The wafer is supported in a specific attitude by the sloped surface inside this recess.

REFERENCES:
patent: 6073576 (2000-06-01), Moslehi et al.
patent: 6165276 (2000-12-01), Lu et al.
patent: 05136252 (1993-06-01), None

Affiliated with

Also associated with

Rating

Semiconductor manufacturing apparatus, and positioning jig... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor manufacturing apparatus, and positioning jig..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor manufacturing apparatus, and positioning jig... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3401107