Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making printing plates
Reexamination Certificate
2007-03-27
2007-03-27
Young, Christopher G. (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making printing plates
C430S322000, C430S331000, C355S030000, C355S053000, C359S649000, C359S656000
Reexamination Certificate
active
10983655
ABSTRACT:
A semiconductor manufacturing apparatus includes a liquid supplying section for supplying a liquid onto a stage for holding a wafer on which a resist film is formed; an exposing section for irradiating the resist film with exposing light through a mask with the liquid provided on the resist film; and a removing part for removing, from the liquid, a gas included in the liquid. Thus, the liquid from which the gas has been removed is provided on the resist film, and therefore, foams included in the liquid or formed during the exposure can be removed. Accordingly, exposure abnormality such as diffraction abnormality can be prevented, resulting in forming a resist pattern in a good shape.
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M. Switkes, et al. “Immersion lithography at 157nm”, J. Vac. Sci. Technol., B 19(6), Nov./Dec. 2001, pp. 2353-2356.
Notice of Reasons for Rejection dated May 30, 2006.
Endo Masayuki
Sasago Masaru
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