Semiconductor manufacturing apparatus

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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Details

118723R, 1341043, 20429802, 20429831, C23C 1600

Patent

active

058370943

ABSTRACT:
In a semiconductor manufacturing apparatus, the number of fine particles is counted by a particle monitor 15 mounted to a part of an exhaust pipe 12 for exhausting a gas in a process chamber 4, and an end point detection controller 31 observes the count value in time sequence to detect an end point time of plasma etching or plasma cleaning. Further, in a semiconductor manufacturing apparatus, it is possible to calibrate a detection accuracy of the particle monitor with high accuracy.

REFERENCES:
patent: 5083865 (1992-01-01), Kinney et al.
patent: 5271264 (1993-12-01), Chanayem
patent: 5424558 (1995-06-01), Boden et al.
patent: 5525158 (1996-06-01), Tsukazaki et al.

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