Semiconductor leadframe and its production method and plastic en

Details Semiconductor leadframe and its production method and plastic en Semiconductor leadframe and its production method and plastic en

1995-04-18

1996-11-05

Walberg, Teresa J.

Electric heating

Metal heating

By arc

21912167, 219 5622, 228159, B23K 2600, B23K 2802

Patent

active

055714285

ABSTRACT:
A method of producing a leadframe for use in semiconductor devices, comprises the steps of forming a space between leads 1a and 1b which are to be overlapped and welded each other, and welding the leads at a region including the space and melting and cutting off one of the leads. In one of the leads which is melted, cohesion and separation of molten metal occur in the region around the space. As a result, unnecessary portions such as an outer frame used for positioning can be cut off at the same time when the leads are connected by welding. Thus, high precision positioning of a plurality of element leadframes as well as high assembling productivity are achieved.

REFERENCES:
patent: 4219143 (1980-08-01), Gailland
patent: 4445271 (1984-05-01), Grabbe
patent: 4920074 (1990-04-01), Shimizu et al.
patent: 5147815 (1992-09-01), Casto
Japanese abstract 56-169312, Welding Method of Lead Terminal of Coil, Hironori Nomura, Dec. 1981, abstract and figure.

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