Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1993-01-19
1993-10-05
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257676, 257786, H01L 2348
Patent
active
052508404
ABSTRACT:
A semiconductor lead frame is disclosed to improve the characteristics and reliability of a semiconductor device using lines of bonding pads in a cross-arrangement. The semiconductor lead frame comprises a rectangular semiconductor chip with a plurality of output terminals of associated circuits, a plurality of leads having inner and outer ends, bus bars extending around the inner ends of the leads, at least one insulator disposed between the semiconductor chip and the inner ends of the leads for electrically insulating the chip and the leads, metal wires electrically connecting the inner ends of the leads to selected and respective bonding pads and the bus bars to the pads in common. The leads are inclined relative to the lines of pads to form a line of outer terminals for the lead frame which extend over a distance exceeding the length of the chip. The semiconductor device can thereby accommodate a great number of bonding pads in response to the high density demand without increasing the size of the chip.
REFERENCES:
patent: 4916519 (1990-04-01), Ward
patent: 5016082 (1991-05-01), Roth
Jeong Hyeon J.
Kwon Heung K.
Oh Dong Y.
Clark S. V.
Hille Rolf
Samsung Electronics Co,. Ltd.
LandOfFree
Semiconductor lead frame with a chip having bonding pads in a cr does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor lead frame with a chip having bonding pads in a cr, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor lead frame with a chip having bonding pads in a cr will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1006738