Semiconductor lead frame lead stabilization

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With work feeding or handling means

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Details

29827, 1565831, 26427215, 437212, B32B 3120, H01L 21447

Patent

active

054964350

ABSTRACT:
The invention is to an apparatus and method for applying a plastic material to a lead frame for stabilizing the leads and retaining them in a common plane.

REFERENCES:
patent: 2958120 (1960-11-01), Taylor
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patent: 3517438 (1970-06-01), Johnson et al.
patent: 4893169 (1990-01-01), Rusch et al.
patent: 5098863 (1992-03-01), Dolezal et al.
patent: 5258331 (1993-11-01), Masumoto et al.
patent: 5268331 (1993-12-01), Abbott

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