Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent
1993-09-21
1995-10-03
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
257666, 257668, H01L 2348, H01L 2962, H01L 2944, H01L 2952
Patent
active
054554543
ABSTRACT:
A semiconductor lead frame is disclosed. An adhesive tape is attached on one end part of inner leads and a bus bar, and a semiconductor chip is mounted on the adhesive tape without using a conventional die pad, wherein the inner leads is formed with a gap to be separated from neighboring leads by etching and the adhesive tape is supported by the bus bar so that the reliability of a semiconductor package is enhanced, and a labor for the development and production of the semiconductor package is saved because semiconductor chips of a variable size can be mounted on the same kind of the semiconductor package by changing only the adhesive tape without preparing another lead frame.
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Jeung Do S.
Oh Seh H.
Clark S. V.
Crane Sara W.
Samsung Electronics Co,. Ltd.
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