Semiconductor lead frame and packaging method

Details Semiconductor lead frame and packaging method Semiconductor lead frame and packaging method

1997-02-27

1998-05-26

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With bumps on ends of lead fingers to connect to semiconductor

257666, H01L 23495

Patent

active

057570698

ABSTRACT:
A semiconductor lead frame in which a semiconductor chip is mounted using an insulating adhesive film. The semiconductor lead frame includes an inner lead and a plating layer. The inner lead has a plating groove formed therein at an end portion of a surface opposite a surface to which the insulating adhesive film is attached. The plating layer rests on the plating groove such that an upper surface of the plating layer and the opposite surface of the inner lead are flush. Since the upper surfaces of the plating layer and the inner lead are flush, a pressing force by a heater is uniformly transmitted to a semiconductor chip, thereby improving adhesion reliability of the semiconductor chip.

REFERENCES:
patent: 4701363 (1987-10-01), Balber
patent: 5359223 (1994-10-01), Nakamori
patent: 5521426 (1996-05-01), Russell
patent: 5635755 (1997-06-01), Kinjhorn
patent: 5648682 (1997-07-01), Nakazawa

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