Semiconductor interconnect structure for high temperature applic

Details Semiconductor interconnect structure for high temperature applic Semiconductor interconnect structure for high temperature applic

1997-03-12

1999-09-07

Loke, Steven H.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257678, 257698, 257702, 257723, 257725, H01L 23495, H01L 2304, H01L 2314, H01L 2334

Patent

active

059491337

ABSTRACT:
A circuit module includes at least one high temperature semiconductor chip having chip pads; a substrate having substrate metallization, the chip pads and the substrate metallization being substantially planar; and a deposited flexible pattern of electrical conductors capable of withstanding high temperatures and coupling selected chip pads and portions of the substrate metallization. The deposited flexible pattern of electrical conductors includes a plurality of integral interconnect segments, at least one of the integral interconnect segments including first and second leg portions and a shelf portion with the shelf portion being spaced apart from the at least one semiconductor chip and substrate and being coupled by the first leg portion to a selected chip pad and by the second leg portion to one of another selected chip pad or a selected portion of the substrate metallization.

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