Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
Reexamination Certificate
2008-08-01
2010-11-30
Booth, Richard A. (Department: 2812)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
On insulating substrate or layer
C438S275000, C257SE21662
Reexamination Certificate
active
07842561
ABSTRACT:
A chip with increased impact resistance, attractive design and reduced cost, and a manufacturing method thereof are provided. A semiconductor integrated circuit is formed on a large glass substrate, and a part of data of a ROM included therein is determined by an ink jet method or a laser cutting method. Accordingly, the cost can be reduced without requiring a photomask, resulting in an inexpensive ID chip. Further, depending on the application, the semiconductor integrated circuit is transposed to a flexible substrate, thereby an ID chip with improved impact resistance and more attractive design can be achieved.
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Booth Richard A.
Robinson Eric J.
Robinson Intellectual Property Law Office P.C.
Semiconductor Energy Laboratory Co,. Ltd.
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