Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Patent
1993-09-02
1995-05-16
Prenty, Mark V.
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
257530, 257734, 257758, 257760, 257773, 257798, H01L 2348, H01L 2946, H01L 2962, H01L 2960
Patent
active
054163552
ABSTRACT:
An electronic element is provided which includes a pair of electrodes (referred to as facing electrodes) formed within the groove of an insulating film on the substrate, the end portions of the electrodes being separated and facing each other in the groove. When a voltage of a predetermined value or more is applied between the facing electrodes, there occurs a cold cathode emission which causes a flow of electrons from one of the electrodes to the other. At that time, the facing electrodes are melted by heat generated by the applied voltage, and either a short circuit or insulation between the facing electrodes, is attained, depending on the selected structure of the element. In this way, the electronic element of the present invention can perform the protection of semiconductor devices and semiconductor circuits. Also, the electronic element of the present invention can perform the operation of selecting a desired load resistance to be applied to a specific circuit.
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Jr. Carl Whitehead
Matsushita Electronics Corporation
Prenty Mark V.
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