Semiconductor integrated circuit package, printed circuit...

Details Semiconductor integrated circuit package, printed circuit... Semiconductor integrated circuit package, printed circuit...

2011-03-15

2011-03-15

Le, Thao X (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S736000, C257S750000, C257SE23019

Reexamination Certificate

active

07906840

ABSTRACT:
A semiconductor integrated circuit package, a printed circuit board, a semiconductor apparatus, and a power supply wiring structure that allow attainment of stable power source and ground wiring without causing resonance even in a high-frequency bandwidth are provided. In an interior portion of the package, a power source wiring and a ground wiring constitute a pair wiring structure in which the power source wiring and the ground wiring are juxtaposed at a predetermined interval so as to establish electromagnetic coupling therebetween. A plurality of pair wiring structures are combined in such a manner that, when viewed in a section perpendicular to a wiring extending direction, the pair wiring assembly assumes a staggered (checkered) configuration. It is preferable that, each of the silicon chip and the printed circuit board, like the package, has pair wiring structures disposed inside.

REFERENCES:
patent: 4946645 (1990-08-01), Namiki et al.
patent: 6522173 (2003-02-01), Otsuka
patent: 6670830 (2003-12-01), Otsuka et al.
patent: 6961229 (2005-11-01), Otsuka et al.
patent: 6975489 (2005-12-01), Otsuka et al.
patent: 2001/0047588 (2001-12-01), Schaper
patent: 2002/0008597 (2002-01-01), Otsuka et al.
patent: 01-246344 (1989-10-01), None
patent: 08-181445 (1996-07-01), None
patent: 11-284126 (1999-10-01), None
patent: 2001-211211 (2001-08-01), None
patent: 2002-026272 (2002-01-01), None
patent: 2003-218223 (2003-07-01), None
patent: 2004-007657 (2004-01-01), None
patent: 2004-221185 (2004-08-01), None
patent: 2004-259722 (2004-09-01), None

Affiliated with

Also associated with

Rating

Semiconductor integrated circuit package, printed circuit... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor integrated circuit package, printed circuit..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor integrated circuit package, printed circuit... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2724333