Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1996-12-13
1998-06-30
Picardat, Kevin
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
435107, 435108, H01L 2160
Patent
active
057733210
ABSTRACT:
A method of counting semiconductor integrated circuit devices comprising steps of forming a semiconductor device block having a plurality of semiconductor integrated circuit devices of vertical mounting type coupled to each other in parallel, and mounting the semiconductor device block on a printed board. A block of semiconductor integrated circuit devices comprising a plurality of semiconductor integrated circuit devices of vertical mounting type, and coupling means for coupling the plurality of semiconductor integrated circuit devices each other in parallel.
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Hirayama Kenji
Ishikawa Toshimitsu
Kitamura Atsushi
Kabushiki Kaisha Toshiba
Picardat Kevin
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