Semiconductor integrated circuit device particularly for high sp

Details Semiconductor integrated circuit device particularly for high sp Semiconductor integrated circuit device particularly for high sp

1988-04-13

1990-08-14

Carroll, J.

Wave transmission lines and networks

Automatically controlled systems

With control of equalizer and/or delay network

357 71, 357 74, 333247, H01L 2348, H01L 2302, H01L 3902

Patent

active

049491636

ABSTRACT:
The semiconductor integrated circuit device of high speed operation can be obtained by adopting the feed-through termination system and by making the wiring pattern in that case as being of construction folded in the direction of thickness of the supporting circuit substrate, without increasing the housing density of the outer lead. In addition, since matching resistor is mounted on the external wall of the substrate, the manufacturing process is also simple without the making the outside dimensions of the substrate large.

REFERENCES:
patent: 4751482 (1988-06-01), Fukuta et al.

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