Semiconductor integrated circuit device including...

Electrical computers and digital processing systems: support – Computer power control

Reexamination Certificate

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Reexamination Certificate

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08046599

ABSTRACT:
In a semiconductor integrated circuit device including a nonvolatile memory device and a semiconductor integrated circuit board which are mounted on a wiring board where the nonvolatile memory is enable to electrically program data therein at a first voltage and the semiconductor integrated circuit board is operable at a second voltage lower than the first voltage, the nonvolatile memory device has a first terminal supplied with the first voltage and a second terminal for outputting the second voltage, the semiconductor integrated circuit board has a third terminal which is electrically connected to the second terminal. The nonvolatile memory device includes a voltage converting circuit, disposed between the first terminal and the second terminal, for converting the first voltage into the second voltage. The nonvolatile memory device is stacked on the semiconductor integrated circuit board.

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U.S. Appl. No. 12/603,754, filed Oct. 22, 2009. Firs named inventor: Koji Yano. For Method of Manufacturing a Single Chip Semiconductor Integrated Circuit Device Including a Mask ROM in a Short Time.
Related U.S. Appl. No. 11/881,224, filed Jul. 26, 2007; Inventors: Yuichi Yuasa and Noriyoshi Watanabe, Title: Semiconductor Intergrated Circuit Device Having Reduced Terminals and I/O area.
Related U.S. Appl. No. 11/881,223, filed Jul. 26, 2007; Inventors: Koji Yano and Tomoki Segawa, Title: Method of Manufacturing a Single Chip Semiconductor Integrated Circuit Device Including a Mask ROM in a Short Time.
Taiwanese Office Action dated Sep. 1, 2010 in counterpart Taiwanese Application No. 096118960.

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