Semiconductor integrated circuit device capable of surely electr

Details Semiconductor integrated circuit device capable of surely electr Semiconductor integrated circuit device capable of surely electr

1997-11-21

2000-06-06

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

257676, 257686, 257777, 438107, 438118, H01L 2348

Patent

active

060722436

ABSTRACT:
There is provided a semiconductor integrated circuit device having integrally a flat-plate-shaped die pad 11 formed in a lead frame 10, a first semiconductor chip 7 bonded via a first adhesive layer 1 to one surface 11a of the die pad 11 and a second semiconductor chip 8 bonded via a second adhesive layer 2 to the other surface 11b of the die pad 11. The first adhesive layer 1 is comprised of an insulating film having a specified thickness. The first semiconductor chip 7 and the second semiconductor chip 8 can be surely electrically insulated from each other.

REFERENCES:
patent: 5214307 (1993-05-01), Davis
patent: 5432380 (1995-07-01), Jin et al.
patent: 5536970 (1996-07-01), Higashi et al.
patent: 5545922 (1996-08-01), Golwalkar et al.

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