Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent
1997-02-28
1998-06-16
Brown, Peter Toby
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
257691, 257692, 257790, H01L 2331, H01L 2348
Patent
active
057675724
ABSTRACT:
A plurality of electrodes are formed on one surface of a semiconductor integrated circuit chip. A plurality of leads are arranged around the chip. Each of the electrodes and one end of each of the leads are connected. The electrodes and the chip are sandwiched between two films. One of the films is in direct contact with the one surface of the chip. The other film is in direct contact with the other surface of the chip.
REFERENCES:
patent: 5130783 (1992-07-01), McLellan
patent: 5160999 (1992-11-01), Opitz
patent: 5448106 (1995-09-01), Fujitsu
patent: 5672908 (1997-09-01), Fujitsu
Brown Peter Toby
Kabushiki Kaisha Toshiba
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